Technology |
Normal |
Special |
R & D |
Features on Board |
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Trace Width
Minimum Line Width / Space (H OZ)
Minimum Line Width / Space (1 OZ)
Minimum Line Width / Space (2 OZ) |
≥ 5 / 5
6 / 6
≥ 8 / 8 |
4 / 4
5 / 5
7 / 7 |
≤ 3 / 3
≤ 4 / 4
≤ 6 / 6 |
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Clearances (Plane Layers)
Clearance (Knock Out Pads)
Split Planes Spacing |
≥ 12
≥ 10 |
10
8 |
≤ 8
≤ 8 |
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Drilling
Annular Ring (1-6) Layers
Annular Ring (8-10) Layers
Annular Ring (≤ 12) Layers
Aspect Ratio
Minimum Drilled Hole Size
Maximum Drilled Hole Size
Second Stage Drilling (DRL to CU Space) |
≥ 6
≥ 6
≥ 7
8 : 1
11.5
255
≤ 4 |
5
5
6
12 : 1
10
N/A
N/A |
≤ 4
≤ 4
≤ 5
14 : 1
8
N/A
N/A |
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Pitch
BGA
SMT |
1 MM
≥ 20 |
0.8 MM
16 |
0.5 MM
≤ 15 |
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Solder Mask Dams
Solder Mask Dams (Over Laminate)
Solder Mask Dam (Over Copper) |
≥ 3
≥ 53 |
2
4 |
< 2
< 4 |
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Legend
Legend (Line Width)
Legend Font |
≥ 8
≥ 50 x 60 |
7
40 x 50 |
< 7
< 40 x 50 |
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Impedance (Tolerance)
50 OHMS
75 OHMS
100 OHMS |
+/- 10%
+/- 10%
+/- 10% |
+/- 5%
+/- 5%
+/- 5% |
< +/- 5%
< +/- 5%
< +/- 5% |
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