Leading Edge Technologies

• Fully automated 57,000 sq ft facility
• Hybrid Technology boards.
• Mixed Dielectric Construction.
• 250 mils maximum board thickness.
• 0.25 oz minimum and 5 oz maximum copper.
• 4 mils traces & spacing (with 0.5 oz copper).
• 5 mils annular ring and 9 mils clearance.
• 6 mils finished hole.
• 4 mils finish hole (Blind via) on up to 15 mils core.
• 12 : 1 aspect ratio (Laminate thickness to drill hole).
• 4 mils min. inner layer cores.
• 0.5 mm SMT pitch & 0.8 mm BGA pitch.
• 2 mils solder mask dams between SMT pads.
• Controlled Impedance Modeling with TDR Testing.
• Maximum panel size 21” x 26” (up to 6 layers) & 18” x 24” for the balance.