Products |
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- Multi-layers up to 30 layers
- Flex & Rigid-Flex
- Blind / Buried via
- High Performance Dielectric Technologies
- Mixed Dielectric / Hybrid constructions
- Controlled Impedance
- Plasma Desmear / Etchback
- Conductive & Non-conductive via fill
- Carbon Paste
- Selective Gold
- Coloured Soldermask & Silkscreen
- Vacuum, Moisture proof Packaging
- CTI Job Tracking Software
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Materials |
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Standard Materials |
- IS-402 (Tg 130 -140º C) –In stock.
- FR-406 High-TG (Tg 170) –In stock
- Polyimide (Tg 260 º C) –Selected stock.
- BT Epoxy (G200) –Selected stock.
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High Frequency Materials |
- IS-408HR ( Tg 200 C )
- IS-408 (Tg 180º C) –High Tg with low Dk (3.8) –Selected stock.
- Nelco 4000-13 –High Tg with low Dk (3.8) –Special order.
- Rogers 3000, 4000, 5000 & 6000 series. –Selected stock for 4000 & rest special order.
- Arlon 25 series-Special stock for Redline
- PTFE/ Teflon –Special order.
- Taconic –Special order.
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Lead Free Materials |
- PCL 370HR (Tg 180º C)
- IS-410 (Tg 180º C)
- IS-410, Matsushita MEM 1755 and Nelco 4000-13 (High Tg) laminates.
- These materials are phenolic based with high decomposition (Td) temperature.
- Processes like regular FR-4 type materials
- Better z-axis properties and low water absorption at higher temperatures gives better stability during high temperature lead free assembly.
Note:
a) All laminates being used at Circuit-tech are ROHS compliant.
b) IS-410 is always in stock, MEM 1755 is limited stock and Nelco
4000-13 is a special order. |
