Technology Roadmap
Technology |
Standard Tech |
Leading Edge Tech |
Future Tech |
| Line Width / Space Phototool | .004 /.0035 | .003 /.003 | .002 /.002 |
| Minimum Plated hole ( mech. Drill size ) | .008 | .006 | .004 |
| Minimum Pad Diameter | .018 | .014 | .010 |
| SMT pitch | .020 | .016 | .015 |
| BGA pitch | 1mm | 0.8mm | 0.5mm |
| Plane clearance ( over drill size ) | .018 | .014 | .01 |
| Aspect Ratio | 10:1 | 12:1 | 14:1 |
| Maximum number of layers | 20 | 24 | 30 |
| Minimum Web ( Dam ) | .003 | .002 | .002 |
| Legend ( Line width ) | 5 | 4 | 3 |
| Via Filling / Conductive and Non- Conductive Planarization | No |
Yes | Yes |
| Micro-via ( Blind/Buried ) | Yes | Yes | Yes |
| Micro Via Laser Drilling | No | No | Yes |
| Flex / Rigid - Flex | No | Yes | Yes |
Material Requirements |
Standard Tech |
Leading Edge Tech |
Future Tech |
Panel size ( max ) |
21 x 24 |
21 x 24 |
21 x 26 |
Core thickness ( min ) |
.004 |
.0035 |
.003 |
Panel thickness ( max ) |
.200 |
.250 |
.250 |
Copper wt ( min ) |
H oz |
¼ oz |
¼ oz |
Copper wt ( max ) |
4 oz |
4 oz |
4 oz |
Temp Ratings |
Standard Tech |
Leading Edge Tech |
Future Tech |
FR-4 140-150 Tg |
Yes |
Yes |
Yes |
FR-4 170-180 Tg |
Yes |
Yes |
Yes |
Polyimide 260 Tg |
Yes |
Yes |
Yes |
BT Epoxy |
Yes |
Yes |
Yes |
High Frequency |
Standard Tech |
Leading Edge Tech |
Future Tech |
( RoHS ) IS410/370 HR/MEM-1755 |
Yes |
Yes |
Yes |
Nelco N4000-13 |
Yes |
Yes |
Yes |
Rogers 4000 series |
Yes |
Yes |
Yes |
Arlon 25 series |
Yes |
Yes |
Yes |
Teflon |
Yes |
Yes |
Yes |
Isola FR-408 |
Yes |
Yes |
Yes |
HDI Materials |
Standard Tech |
Leading Edge Tech |
Future Tech |
Thermount |
No |
Yes |
Yes |
RCC ( Resin Coated Copper Foil ) |
No |
Yes |
Yes |
CAF/Halogen Free |
Yes |
Yes |
Yes |
Metal Core Bonding |
No |
Yes |
Yes |
Finishes |
Standard Tech |
Leading Edge Tech |
Future Tech |
Hot –Air-Solder-Level ( HASL ) |
.0003 |
.0002 |
.0002 |
Immersion Gold ( ROHS/Lead Free ) |
3 – 5 u inch |
3 – 5 u inch |
3 – 5 u inch |
Immersion Silver ( ROHS/Lead Free ) |
8 – 14 u inch |
8 – 14 u inch |
8 – 14 u inch |
Immersion Tin ( ROHS/Lead Free ) |
No |
Yes |
Yes |
Electrolytic Soft Gold |
Outsource |
30 u inch |
30 u inch |
Electrolytic Hard Gold |
Outsource |
50 u inch |
50 u inch |
Gold Tabs |
30 – 50 u inch |
30 – 50 u inch |
30 – 50 u inch |
Lead Free HASL ( ROHS/Lead Free ) |
No |
Yes |
Yes |
Soldermask |
Standard Tech |
Leading Edge Tech |
Future Tech |
Minimum Web ( Dam ) |
.003 |
.002 |
.002 |
Via Plug – Secondary Screen |
Yes |
Yes |
Yes |
Tolerances |
Standard Tech |
Leading Edge Tech |
Future Tech |
Layer to Layer Registration |
+/- .005 |
+/- .004 |
+/- .004 |
Hole Locations |
+/- .003 |
+/- .003 |
+/- .002 |
Line Width ( Half ounce Copper ) |
+/- .001 |
+/- .0007 |
+/- .0005 |
Board Thickness |
+/- 10% |
+/- 8% |
+/- 6% |
Controlled Impedance |
+/- 10% |
+/- 10% |
+/- 5% |
Warpage |
.70% |
.50% |
.50% |
Electrical Testing |
Standard Tech |
Leading Edge Tech |
Future Tech |
Double Sided / Clamshell |
.015 pitch |
.015 pitch |
.012 Pitch |
Flying Probe Tester |
.006 Pitch |
.006 Pitch |
.004 Pitch |
